Mechanical Engineer

  • Job Tracking ID: 2018R-4151-71
  • Job Location: Herndon, VA
  • Job Level: Mid Career (2+ years)
  • Level of Education: BA/BS
  • Job Type: Full-Time/Regular
  • Date Updated: November 28, 2018
  • Years of Experience: 3+
  • Starting Date: ASAP





Job Description:

As a global leader in IP-based satellite communications, we are the change agent, shaping the future of how the world connects. Our team is helping the world’s leading satellite operators and service providers capture the future through major innovation. The most fulfilling work of your career is waiting for you at iDirect…imagine your talent and energy paired with our vision and technical leadership: the sky is truly the limit!

We are seeking a team player with solid mechanical engineering skills to work as a mechanical engineer for assigned projects in our Hardware Design Services team. The Candidate will be responsible for all mechanical aspects of the electronics hardware packaging design for high technology satellite modem products at the chip level, board level, and enclosure level. Custom enclosure design and development will be a major area of focus. The candidate will participate in full product life cycle from Concept, Industrial Design, Analysis, Development, Prototyping, Testing, Production Release, and ongoing Production Support. Competency in mechanical design and heat transfer is required along with an understanding of manufacturing and cost implications. One must work well with multi-disciplined engineering teams, including Digital EE’s, RF EE’s, Manufacturing Engineers, and Product Line Management.

JOB RESPONSIBLITIES:

  • Responsible for the mechanical design and thermal analysis of assigned projects.
  • Conduct design reviews and be accountable for meeting goals and schedule milestones.
  • Research, conceptualize, design, develop and test novel packaging solutions for electronic communications equipment.
  • Responsible for all heat transfer solutions for new products. Complete thermal analysis simulations and results that drive design decisions.
  • Generate design documentation and test reports per hardware development process including testing to environmental requirements.
  • Support for ongoing production.

Experience and Skills:

EDUCATION: BSME in Mechanical Engineering. (MSME Desired).

EXPERIENCE: 3 or more years of experience in Mechanical Engineering:

  • Knowledge of electronics packaging design and mechanical design for Printed Circuit Boards.
  • Minimum of 2 years of experience with 3D CAD Tool is a must. Experience with PTC Creo desired.
  • Experience with performing tolerance stackup analysis for PCB assemblies and packaging designs.
  • Thermal, shock, and vibration testing of electronic products desired.
  • Knowledge of thermal modeling and simulation techniques with some experience desired with a CFD package such as FloTherm, FloEFD, or Autodesk CFD.
  • Knowledge for high/low volume design techniques (including plastics, die castings, extrusions, sheet metal, & elastomers).
  • Familiarity with design of cabling and wiring harness.
  • Experience creating engineering drawings per ASME Y14.5-2009.
  • Additional desired skills include design for manufacturability, design for Electromagnetic Interference, and design for communications equipment.
  • Knowledge of environmental & regulatory test standards and compliance techniques desired, especially shock, vibration, HALT/HASS.
  • Experience with Agile PLM or other Configuration Management Tools as well as version control tools.

Professional Qualities:

  • Has a ‘can do’ attitude - willing to dive into and take ownership of critical availability issues.
  • Eager to work in a fast paced development environment.
  • Must be able to analyze and solve technical problems.
  • Must have strong interpersonal skills and be self-motivated.
  • Completes tasks in a timely manner.
  • Communicates effectively on a technical level.
  • Can work under pressure in high visibility situations.
  • Flexible - able to quickly adapt to changing conditions and make decisions based on incomplete data.
  • Must be effective as a single contributor or as a team member as the situation warrants.